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Samsung Recruitment 2023
| * Role: | Physical Design-Engineer |
| * Salary: | 5.5LPA(Expected) |
| * Location: | Bangalore |
| * Experience: | Freshers |
| * Education | B.E/B.Tech/M.E/M.Tech/PhD |
| * Batch | Any-Batch |
Samsung Recruitment 2023 Hiring Physical Design Engineer -| B.E/B.Tech/M.E/M.Tech/PhD
The detailed eligibility Criteria and application process are mentioned below.
Job Description
What we offer
Samsung is a global leader in technology, opening new possibilities for people everywhere. In our center you will be part of a dynamic team, in an international work environment. Being one of the best in the industry comes with hard work, but we also make it rewarding through:
Best in the industry compensation
Free breakfasts and lunches in our office
Flexible working hours/ Hybrid work environment
Transport facilities
Health & wellbeing: wellness program, e.g. subsidized gym subscription
Quarterly team events and various team activities
Learning and Development opportunities
Role and Responsibilities
- Complex SOC Top Physical Implementation for next generation SOCs in area of mobile application processors, modem sub-systems and connectivity chips by means of Synthesis , Place and Route, STA , timing and physical signoffs
- Hands on experience doing physical design and timing closure of complex blocks and full-chip designs.
- Experience in top level floor planning including partition shaping and sizing, pin placement, channel planning, high speed signal and clock planning and feed-through planning is a plus.
- Should have strong understanding of timing, power and area trade-offs and optimization of PPA.
- Power user of industry standard tools (ICC/DC/PT/VSLP/Redhawk/Calibre/Formality) and able to understand their capabilities.
- Should have solid understanding of scripting languages such as Perl/Tcl and implementation flows.
- Experience with large SOC designs (>20M gates) with frequencies in excess of 1GHZ .
- Expertise in block level and full-chip SDC clean up, Synthesis optimization , Low Power checking and logic equivalence checking.
- Familiar with deep sub-micron designs (8nm/5nm) and associated issues (manufacturability, power, signal integrity, scaling).
- Familiar with typical SOC issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.
- Familiar in hierarchical design, top-down design, budgeting, timing and physical convergence.
- Good understanding of Physical Design Verification methodology to debug LVS/DRC issues at chip/block level.
- Should have gone through recent successful SOC tape-outs.
Skills and Qualifications
B.E/B.Tech/M.E/M.Tech/PhD
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How to Apply For Company Recruitment 2023 – (Please Apply before Expire date of the link)
If you are interested and eligible. You can register or apply for this Recruitment online. Please click the below link to Apply ASAP
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